SECTORS & SUBSECTORS

Semiconductors

Fabless Design

Companies that design chips but outsource manufacturing to foundries. Examples: NVDA, AMD, AVGO, QCOM.

Foundry

Companies that manufacture chips designed by others. TSM (TSMC) manufactures over 90% of the world's leading-edge chips.

IDM (Integrated Device Manufacturer)

Companies that both design and manufacture their own chips. Examples: INTC (Intel), MU (Micron).

Equipment

Companies that build the machines used to manufacture chips. ASML (lithography), AMAT (deposition), LRCX (etch), KLAC (inspection).

OSAT & Packaging

Companies that package, assemble, and test manufactured chips. Includes advanced packaging technologies like CoWoS.

EDA & IP

Companies that make the software tools used to design chips. Examples: CDNS (Cadence), SNPS (Synopsys).

Power & Analog

Companies specialising in power management and analog semiconductor devices. Examples: TXN, ADI, IFX GR (Infineon).

Robotics

Industrial Robots

Manufacturers of robotic arms and systems for factory automation. The "Big Four": 6954 JP (Fanuc), ABBN SW (ABB), Yaskawa, KUKA.

Humanoid & Service

Companies developing humanoid robots or service robots for non-industrial applications. Predominantly private companies (Figure, 1X Technologies, Boston Dynamics).

Surgical & Medical

Robotic systems for surgical procedures. ISRG (Intuitive Surgical) holds approximately 80% market share with da Vinci.

Warehouse & Logistics

Automated systems for warehousing, sorting, and fulfilment operations.

Autonomous Systems & Drones

Self-navigating vehicles, unmanned aerial vehicles, and autonomous flight systems.

Machine Vision & Sensors

Cameras, LiDAR, and sensor systems enabling robot perception. Example: 6861 JP (Keyence).

Motion Control & Actuators

Servo drives, motors, and actuators enabling robotic movement. Examples: 2308 TT (Delta Electronics), SU FP (Schneider Electric).

Software & Simulation

Platforms for robot programming, digital twins, and factory simulation. Examples: SIE GR (Siemens), ROK (Rockwell), EMR (Emerson).

Space

Launch

Companies providing orbital launch services. Examples: RKLB (Rocket Lab — Electron, Neutron).

Satellite Comms

Companies operating satellite communication networks. Examples: SATS (EchoStar), ASTS (AST SpaceMobile).

Earth Observation

Companies operating satellite constellations for imaging Earth's surface. Examples: PL (Planet Labs), SATL (Satellogic).

Space Components

Manufacturers of precision components for satellites and launch vehicles. Examples: HEI (HEICO), KRMN (Karman).

Ground Systems & Antennas

Infrastructure for communicating with and controlling satellites from the ground.

Materials & Inputs

Industrial & Specialty Gases

Gases used in semiconductor fabrication (nitrogen, argon, neon for EUV) and rocket propulsion. Oligopoly: LIN (Linde), AI FP (Air Liquide), APD (Air Products).

Process Chemicals

Photoresists, CMP slurries, and deposition precursors for chip manufacturing. Example: MRK GR (Merck KGaA).

Packaging & Substrates

IC substrates and ceramic packages for chip packaging. Examples: 3037 TT (Unimicron), 6971 JP (Kyocera).

Rare Earths & Critical Minerals

Mining and processing of rare earth elements for permanent magnets (NdFeB) in motors and actuators. China controls ~60% of mining and ~90% of processing. Example: 600111 C1 (Northern Rare Earth).

Battery Materials

Suppliers of lithium, cobalt, and other materials for batteries in robots, satellites, and EVs. Examples: SQM, ALB (Albemarle).

ROBOTNIK METRICS

Bottleneck Risk

CRITICAL — Sole source, no alternative. Disruption halts supply chains. Example: ASML (only EUV supplier).
HIGH — Very limited alternatives. Switching takes years. Example: TSMC (90%+ leading-edge chips).
MEDIUM — Alternatives exist but switching is costly (12-24 months).
LOW — Competitive market with multiple capable suppliers.

Value-Chain Tier

The entity's position in the supply chain, from upstream materials to downstream system deployers.

Robotnik Composite Index

Market-cap-weighted combination of the four sub-indices (Semiconductors, Robotics, Space, Materials & Inputs). Sector mcap shares are recomputed daily from constituent market capitalisations. Base: 1,000 on 31 March 2025.

Sub-Indices

Four sector-specific indices (Semi, Robotics, Space, Materials), each capped at 5% single-entity within its own sector universe and normalised to 1,000 on the base date.

KEY TECHNICAL TERMS

CoWoS

Chip-on-Wafer-on-Substrate. TSMC's advanced packaging integrating multiple dies on one substrate. Primary platform for NVIDIA AI GPUs. Substrate supply has been a binding constraint.

EUV

Extreme Ultraviolet lithography. The most advanced chip patterning technology using 13.5nm wavelength light. ASML is the sole global supplier.

High NA EUV

Next-generation EUV with higher numerical aperture enabling sub-2nm patterning. ASML's EXE:5200 system.

HBM

High Bandwidth Memory. Vertically stacked DRAM connected to processors via a wide interface. Essential for AI GPU performance. Supplied by Micron, Samsung, SK Hynix.

NdFeB

Neodymium-Iron-Boron. The most powerful commercially available permanent magnets, used in servo motors, actuators, and satellite reaction wheels.

HREE

Heavy Rare Earth Elements (dysprosium, terbium). Essential for high-temperature magnets. No commercial processing exists outside China.

GAA

Gate-All-Around. Next-generation transistor architecture replacing FinFET at 2nm and below. Enables higher performance and lower power.